Plating
Gold processes
Gold MC 240 KP
Gold MC 240 KP 0N-9N
Gold MC 210 H
Gold Auroprint
Gold MC 2N18
Gold MC 218
Gold Auroprint DE
Gold MC 210 GR
Gold MC 9000
Gold MC 9020
Gold MC 9005
Gold MC 2001
Gold 0N for pen plating
Gold T1114 1-2N for pen plating
Gold U 2N for pen plating
Gold R 3N for pen plating
Gold Rosé 1 4N for pen plating
Gold Rosé 2 5N for pen plating
Gold SC8 3-4N for pen plating
Gold SC16 3-4N for pen plating
Rhodium processes
Rhodium C2
Rhodium K3
Rhodium Black for Tank
Rhodium white 5B for pen plating
Rhodium white 5E for pen plating
Rhodium black 3 for pen plating
Rhodium blue for pen plating
Palladium processes
Palladium Gapal FS
Palladium Gapal HT
Palladium Gapal TS
Palladium for pen plating
Platinum processes
Ruthenium processes
Ruthenium Rugadec HS2
Ruthenium Rugadec HKN
Ruthenium Rugadec HKD
Silver processes
Silver Arga 380
Silver Arga 400
Precious metal compounds
For electroplating processes precious metal compounds of special quality and purity have to be applied to ensure proper function of the bathes for a long period of time.
Gold
MC 210 H/1 Goldcomplex and MC 210 H/2 Goldcomplex
Potassium goldcyanide GPC 68,2%
IWG-2-liquid and IWG-3-liquid
Palladium
Gapal FS/TS/HT Palladiumcomplex
MC 9000 Palladiumcomplex
